Materials for High-density Electronic Packaging and Interconnection
Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research CouncileBook - 1990
Publisher: Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.
Branch Call Number: ELECTRONIC BOOK
Characteristics: 1 online resource (xiv, 139 p.) : ill.
Call Number: ELECTRONIC BOOK